Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
High temperature Ceramic Substrates means that the sintering temperature is around 1,600 °C (2,910 °F).
In the short term, Japan, United States and Europe will have an unshakable status in HTCC ceramic substrates; China will play an more important role in future, driven by the strong demand from consumer electronics, aerospace & military, automobile electronics and LED market.
The HTCC Ceramic Substrates market was valued at 110 Million US$ in 2018 and is projected to reach 130 Million US$ by 2025, at a CAGR of 2.3% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for HTCC Ceramic Substrates.
This report presents the worldwide HTCC Ceramic Substrates market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
NGK Spark Plug
SCHOTT Electronic Packaging
Semiconductor Enclosures Inc(SEI)
HTCC Ceramic Substrates Breakdown Data by Type
Al2O3 HTCC Substrate
AIN HTCC Substrate
HTCC Ceramic Substrates Breakdown Data by Application
Aerospace & Military
HTCC Ceramic Substrates Production by Region
HTCC Ceramic Substrates Consumption by Region
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global HTCC Ceramic Substrates status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key HTCC Ceramic Substrates manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of HTCC Ceramic Substrates :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (M Piece). Both top-down and bottom-up approaches have been used to estimate and validate the market size of HTCC Ceramic Substrates market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.